nichia sts-da1-1479a nichia corporation specifications for white led nspw500gs-k1 rohs compliant
nichia sts-da1-1479a 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 30 ma pulse forward current i fp 100 ma reverse voltage v r 5 v power dissipation p d 105 mw operating temperature t opr -30~85 c storage temperature t stg -40~100 c junction temperature t j 100 c * absolute maximum ratings at t a =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ unit forward voltage v f i f =20ma 3.1 v luminous intensity i v i f =20ma 33 cd x - i f =20ma 0.31 - chromaticity coordinate y - i f =20ma 0.32 - * characteristics at t a =25c. * the chromaticity coordinates are derived from the cie 1931 chromaticity diagram.
nichia sts-da1-1479a 2 ranks item rank min max unit forward voltage - 2.7 3.5 v reverse current - - 50 a w 31.0 44.0 v 22.0 31.0 luminous intensity u 15.5 22.0 cd color ranks rank a0 rank b1 x 0.280 0.264 0.283 0.296 x 0.283 0.287 0.330 0.330 y 0.248 0.267 0.305 0.276 y 0.305 0.295 0.339 0.360 rank b2 rank c0 x 0.296 0.287 0.330 0.330 x 0.330 0.330 0.361 0.356 y 0.276 0.295 0.339 0.318 y 0.318 0.360 0.385 0.351 * ranking at t a =25c. * reverse current at v r =5v. * tolerance of measurements of the forward voltage is 3%. * tolerance of measurements of the luminous intensity is 10%. * tolerance of measurements of the chromaticity coordinate is 0.01. * basically, a shipment shall consist of th e leds of a combination of the above ranks. the percentage of each rank in the shipment shall be determined by nichia.
nichia sts-da1-1479a 3 chromaticity diagram a0 b1 b2 c0 0.20 0.25 0.30 0.35 0.40 0.45 0.20 0.25 0.30 0.35 0.40 0.45 x y
nichia sts-da1-1479a 4 outline dimensions sts-da7-0354 nspw500gs-k1 ? no. ( g unit: mm) this product complies with rohs directive. u? rohs ?m??? * ( g unit: mm, tolerance: 0.2) ???`? lead standoff 1 0.3 0.3 5.6 (2.5) 1.5 max 12.80.5 9 8 5 5.3 1 (2) anode cathode 1.1 29.31 0.50.05 ? led ???? ??`?? ? ?? ?QH???? `???~? ??? * the tie bar cut-end surface exhibits exposed copper alloy base metal. care must be taken to handle the leds, as it may contain sharp parts such as lead, and can cause injury. ? item ?| resin materials `??`| lead frame materials | weight description ?? ( ?w ) epoxy resin(partly using phosphor) ~? + y? ag-plated copper alloy 0.30g(typ)
nichia sts-da1-1479a 5 soldering ? hand soldering temperature 350c max soldering time 3sec max position no closer than 3mm from the base of the lens. ? dip soldering pre-heat 120c max pre-heat time 60sec max solder bath temperature 260c max dipping time 10sec max dipping position no closer than 3mm from the base of the lens. * for a better thermal performance, copper alloy is used for the leadframe of the product. care must be taken for the soldering conditions and handling of the products after soldering. * solder the led no closer than 3mm from the base of the lens. soldering beyond the base of the tie bar is recommended. * dip soldering and manual sold ering must only be done once. * care should be taken to avoid cooling at a rapid ra te and ensure the peak temperature ramps down slowly. * do not apply any stress to th e lead particularly when heated. * after soldering, the led position must not be corrected. * after soldering, no mechanical shock or vibration should be applied to led lens until the leds cool down to room temperature. * in order to avoid damage on the lens during cutting and cl inching the leads, it is not recommended to solder the leds directly on customer pcb without any gap between the lens and the board. if it is unavoidable, customer is advised to check whethe r such soldering will not cause wire breakage or lens damage. direct soldering to double-sided pcbs must be avoided due to an in creased effect of heat on the lens. * when it is necessary to clamp the leds to prevent soldering failure, it is important to minimize the mechanical stress on the leds. * cut the led lead frames at room temperature. cutting the le ad frames at high temperature may cause failure of the leds.
nichia sts-da1-1479a 6 packaging - bulk ? label attached to the box ? label printed on the bag sts-da7-0001a nxxxxxxx do not drop the cardboard box or expose it to shoc k. if the box falls, the products could be damaged. the cardboard box is not water-resistant. do not expose to water. customer is advised to pack the products in the original packaging or equivalent in transit. ?`?????? y?????? * ? \H?y?B???y? * ?QH n???? u?p?????? * the products are placed loose in anti-static bags. the anti-static bags are packed in cardboard boxes to prevent damage during shipment. * u????? ??n?go??`y? ? for details, see "lot numbering scheme" in this document. * ??????????? if not provided, it is not indicated on the label. ******* is the customer part number. O??????? * ******* ? ?? ? no. rohs nxxxxxxx xxxx led ******* rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs nxxxxxxx ******* xxxx led caution to electrostatic damage ??? nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty pcs ymxxxx-rrr anti-electrostatic bag ?? nichia led ??K? ?`? the anti-electrostatic bags are packed in a cardboard box with corrugated partition.
nichia sts-da1-1479a 7 lot numbering scheme lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx-nichia's product number rrr-ranking by color coordinates, ranking by luminous intensity
nichia sts-da1-1479a 8 derating characteristics nspw500g(s)-k1 sts-da7-0762 ? no. derating1 0 10 20 30 40 50 0 20406080100120 (47, 30.0) (85, 8 .50) dut y 10 100 1000 110100 30 S all owa bl e f orwar d c urr ent ( m a) ??-S ambient temperature vs allowable forward current S allowable forward current(ma) ?? ambient temperature(c) ?` ?` duty ratio(%) ?`?`-S duty ratio vs allowable forward current t a = 25c
nichia sts-da1-1479a 9 optical characteristics nspw500g(s)-k1 ? no. sts-da7-0763 spectrum 0.0 0.2 0.4 0.6 0.8 1.0 3 50 400 450 50 0 550 600 650 700 7 50 relative l umin osity( a.u .) directivity1 90 80 70 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 -8 0 -90 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 10.500.5 1 20ma i f = t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. 20 ma i fp = t a =25c
nichia sts-da1-1479a 10 forward current characteristics / temperature characteristics nspw500g(s)-k1 sts-da7-0764 ? no. i fp = 20 ma i fp = 60 ma i fp = 5 ma tavf 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -60 -40 -2 0 0 20 40 60 80 1 00 120 ta iv 0.6 0.8 1.0 1.2 1.4 -60 -40 -2 0 0 20 40 60 80 1 00 120 vfif 1 10 10 0 2.02.53.03.54.04.55.0 20 relative luminous flux(a.u.) ??- ambient temperature vs relative luminous flux for ward curren t( m a) ifiv 0 1 2 3 4 5 0 20406080100120 relative luminous flux(a.u.) - forward current vs relative luminous flux forw ard current(ma) ?R- forward voltage vs forward current ??-?R ambient temperature vs forward voltage ?R forward volta g e(v) ?R forward voltage(v) ?? ambient tem p erature ( c ) ?? ambient temperature(c) t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. t a =25c i fp = 20 ma
nichia sts-da1-1479a 11 forward current characteristics / temperature characteristics ? no. nspw500g(s)-k1 sts-da7-0765 taxy 0.30 0.31 0.32 0.33 0.34 0.29 0.30 0.31 0.32 0.33 -30c 0c 25c 50c 85c x ifxy 0.30 0.31 0.32 0.33 0.34 0.29 0.30 0.31 0.32 0.33 1ma 5ma 20ma 30ma 100ma x y y 20 ma i fp = ? ? -? ambie nt te mperature vs chromaticity c oordinate -? forward current vs chromaticity c oordinate t a =25c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts-da1-1479a 12 reliability (1) tests and results te s t reference standard test conditions te s t duration failure criteria # units failed/tested resistance to soldering heat jeita ed-4701 300 302 t sld =2605c, 10sec, 1dip, 3mm from the base of the lens #1 0/50 solderability jeita ed-4701 303 303a t sld =2455c, 5sec, lead-free solder(sn-3.0ag-0.5cu) #2 0/50 temperature cycle jeita ed-4701 100 105 -40c(30min)~25c(5min)~ 100c(30min)~25c(5min) 100cycles #1 0/50 moisture resistance (cyclic) jeita ed-4701 200 203 25c~65c~-10c, 90%rh, 24hr per cycle 10cycles #1 0/50 te r m i n a l b e n d strength jeita ed-4701 400 401 5n, 0~90~0bend, 2bending cycles #1 0/50 terminal pull strength jeita ed-4701 400 401 10n, 101sec #1 0/50 high temperature storage jeita ed-4701 200 201 t a =100c 1000hours #1 0/50 temperature humidity storage jeita ed-4701 100 103 t a =60c, rh=90% 1000hours #1 0/50 low temperature storage jeita ed-4701 200 202 t a =-40c 1000hours #1 0/50 room temperature operating life t a =25 , i f =30ma 500hours #1 0/50 temperature humidity operating life 60c, rh=90%, i f =20ma 500hours #1 0/50 low temperature operating life t a =-30c, i f =20ma 500hours #1 0/50 notes: measurements are performed after allowi ng the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria forward voltage(v f ) i f =20ma >u.s.l.1.1 luminous intensity(i v ) i f =20ma u.s.l.2.0 #2 solderability - less than 95% solder coverage u.s.l. : upper specification limit l.s.l. : lower specification limit
nichia sts-da1-1479a 13 cautions (1) lead forming when forming leads, the leads shou ld be bent at a point at lease 3 mm from the base of the epoxy bulb. do not use the base of the leadframe as a fulcrum during lead forming. lead forming should be done before soldering. do not apply any bending stress to the base of the lead. the stress to the base may damage the led's characteristics or it may break the leds. when mounting the product onto a printed circuit board, the via-holes on the board should be exactly aligned with the lead pitch of the product. if the leds are mounted with stress at the leads, it caus es deterioration of the epoxy r esin and this will degrade the leds. (2) storage shelf life of the products in unopened bag is 3 mont hs(max.) at <30c and 70% rh from the delivery date. if the shelf life exceeds 3 months or more, the leds need to be stored in a sealed container with desiccant (silica gel) to ensure their shelf life will not exceed 1 year. nichia led leadframe are silver plat ed copper alloy. this silver surface may be affected by environments which contain corrosive substances. please avoid conditio ns which may cause the led to corrode, tarnish or discolor. this corrosion or discoloration may cause difficulty during soldering operation. it is recommended that the le ds be used as soon as possible. to avoid condensation, the pr oducts must not be stored in the areas where temperature and humidity fluctuate greatly. (3) directions for use in designing a circuit, the cu rrent through each led must not exceed the abso lute maximum rating specified for each led. it is recommended to use circuit b which regulates the current flowing th rough each led. in the meanwhile, when driving leds with a constant voltage in circuit a, the cu rrent through the le ds may vary due to the variation in forward voltage ch aracteristics of the leds. (a) ... (b) ... this product should be operated in forwar d bias. a driving circuit must be designed so that the product is not subjected to either forw ard or reverse voltage while it is off. in particular, if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in led damage. for stabilizing the led characteristics, it is recommen ded to operate at 10% of the rated current or higher. care must be taken to ensure th at the reverse voltage will not exceed the absolute maximum rating when using the leds with matrix drive. for outdoor use, necessary measures should be take n to prevent water, moisture and salt air damage. (4) handling precautions when handling the product, do not touch it directly with bare hands as it may contaminate the surface and affect on optical characteristics. in the worst cases, excessive force to the product mi ght result in catastrophic failu re due to package damage and/or wire breakage. if the product is dropped, it might be damaged. do not stack assembled pcbs together. failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed, and wire to be br oken, and thus resulting in catastrophic failure. (5) design consideration pcb warpage after mounting the products onto a pcb can cause the package to break. the leds should be placed so as to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechanical stress is exerte d on the leds placed near the score lines. the leds should be placed so as to minimi ze the stress on the leds due to board flexing. board separation must be performed using special jigs, not with hands.
nichia sts-da1-1479a 14 (6) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltage. an esd event may damage its die or reduce its reliability performance. when handling the products, measures against electro static discharge, including the followings, are strongly recommended. eliminating the charge; wrist strap, esd footwear and garments, esd floors grounding the equipm ent and tools at workstation esd table/shelf mat (conductive materials) proper grounding techniques are required for all devices, equipment and machinery used in the assembly of the products. also note that surge protection should be considered in the design of customer products. if tools or equipment contain insulating materials, such as glass or plastic, proper measures against electro static discharge , including the followings, are strongly recommended. dissipating the charge with conductive materials preventing the charge generation with moisture neutralizing the charge with ionizers when performing the characteristics inspecti on of the leds in your application, cust omer is advised to check on the leds whether or not they are damaged by esd. such damage can be detected during forward voltage measurement or light up test at low current. (the recomm ended current is 1ma or lower) esd-damaged leds may have an increased leakage current, curren t flow at low voltage, or no longer light up at low current. failure criteria: v f <2.0v at i f =0.5ma (7) thermal management thermal management is an important factor wh en designing your prod uct by using the leds. the rise in led die temperature can be affected by pcb th ermal resistance or/and led spac ing as mounted on the board. customer is advised to design the product to ensure that the led die temperature does not exceed the required maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. (8) cleaning if required, isopropyl alcohol (ipa) should be used. ot her solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. ultrasonic cleaning is not reco mmended for the leds since it ma y adversely effect on the leds by the ultrasonic power and led assembled condition. if it is unavoidable, customer is advised to check prior to use that the cleaning will not damage the leds. (9) eye safety the international electrical commission (iec) publis hed in 2006, iec 62471:2006 photobiological safety of lamps and lamp systems which includes leds within its scope. meanwhile leds were removed from the scope of the iec 60825-1:2007 laser safety standard, the 2001 edition of which included led sources within its scope. however, keep it mind that some countries and regions ha ve adopted standards based on the iec laser safety standard iec 60825-1:2001 which includes leds within its scope. follo wing iec 62471:2006, most of nichia leds can be classified as belonging to either exempt group or risk group 1. especially a high-power led, that emits light containing blue wavelengt hs, may be in risk group 2. great care should be taken when viewing directly the led driven at high current or the led with optical instruments, which grea tly increase the hazard to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, precaution should be taken to avoid adverse e ffect on human body caused by the light stimulus.
nichia sts-da1-1479a 15 (10) others the leds described in this brochure are intended to be used for ordinary electronic equipmen t (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersibl e repeaters, nuclear reactor co ntrol system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer sh all inform nichia directly before disassembling or analysis. customer and nichia shall agree the official specification of supplied products prior to the st art of a customer?s volume prod uction. the appearance and specifications of the produc t may be modified for improvement without notice.
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